ZHANG Xiaotao, ZHENG Zhanping, LI Yicheng. Thermal Structural Coupling Analysis of Gradient Coil Adhesive Curing and Mold Release Method[J]. Chinese Journal of Medical Instrumentation. DOI: 10.12455/j.issn.1671-7104.240598
      Citation: ZHANG Xiaotao, ZHENG Zhanping, LI Yicheng. Thermal Structural Coupling Analysis of Gradient Coil Adhesive Curing and Mold Release Method[J]. Chinese Journal of Medical Instrumentation. DOI: 10.12455/j.issn.1671-7104.240598

      Thermal Structural Coupling Analysis of Gradient Coil Adhesive Curing and Mold Release Method

      • The casting and curing of gradient coils in the production process is a relatively complex process. The chemical process similar to the black box model requires confirmation of the impact of each step's input on the output results, while the curing temperature and molding method affect the roundness and deformation of the gradient coil. The analysis of the curing temperature and molding method of gradient coils has important practical significance for the formation and micro deformation of gradient coils. This article uses ANSYS finite element simulation software to analyze the thermal structural coupling and the specific performance of actual products. It is found that the product quality is more stable under the heat conduction mode, and the roundness of the mold is better when placed vertically and waiting for temperature cooling before being released than when placed horizontally.
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